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  features applications description/ordering information tlv7211 , , tlv7211a cmos comparators with rail-to-rail input and push-pull output slcs149b ? august 2006 ? revised january 2007 battery-powered products parameters specified at 2.7-v, 5-v, and 15-v supplies notebooks and pdas mobile communications supply current 7 m a (typ) at 5 v alarm and security circuits response time 4 m s (typ) at 5 v direct sensor interface push-pull output replaces amplifiers used as comparators input common-mode range beyond with better performance and lower current v cc? and v cc+ low input current the tlv7211 and tlv7211a are micropower cmos comparators available in the space-saving sot-23-5 package. this makes the comparators ideal for space- and weight-critical designs. the tlv7211a features an input offset voltage of 5 mv, and the tlv7211 features an input offset voltage of 15 mv. the main benefits of the sot-23-5 package are most apparent in small portable electronic devices, such as mobile phones, pagers, notebook computers, personal digital assistants, and pcmcia cards. the rail-to-rail input voltage makes the tlv7211 or tlv7211a a good choice for sensor interfacing, such as light detector circuits, optical and magnetic sensors, and alarm and status circuits. the sot-23-5 package's small size allows it to fit into tight spaces on pc boards. ordering information v os t a package (1) orderable part number top-side marking (2) (max) reel of 2500 TLV7211AIDr soic ? d 7211ai tube of 75 TLV7211AID 5 mv sot-23-5 ? dbv reel of 3000 TLV7211AIDbvr ybn_ reel of 3000 TLV7211AIDckr sot (sc-70) ? dck y8_ reel of 250 TLV7211AIDckt ?40 c to 85 c reel of 2500 tlv7211idr soic ? d ty7211 tube of 75 tlv7211id 15 mv sot-23-5 ? dbv reel of 3000 tlv7211idbvr ybk_ reel of 3000 tlv7211idckr sot (sc-70) ? dck y7_ reel of 250 tlv7211idckt (1) package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. (2) dbv/dck: the actual top-side marking has one additional character that designates the assembly/test site. please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. production data information is current as of publication date. copyright ? 2006?2007, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. d package (top view) 1 23 4 8 76 5 ncv cc+ outnc nc inC in+ v ccC nc C no internal connection dbv package (top view) 12 3 54 out v cc+ in+ v ccC inC dck package (top view) 12 3 6 4 out v cc+ in+ ncinC 5 v ccC www.ti.com
absolute maximum ratings (1) esd protection recommended operating conditions tlv7211 , , tlv7211a cmos comparators with rail-to-rail input and push-pull output slcs149b ? august 2006 ? revised january 2007 functional block diagram over operating free-air temperature range (unless otherwise noted) min max unit v cc+ ? v cc? supply voltage (2) 16 v supply v id differential input voltage (3) v voltage v i input voltage range (any input) v cc? ? 0.3 v cc+ + 0.3 v v o output voltage range v cc? ? 0.3 v cc+ + 0.3 v i cc supply current 40 ma i i input current 5 ma i o output current 30 ma d package 97 q ja package thermal impedance (4) (5) dbv package 206 c/w dck package 259 t j operating virtual junction temperature 150 c t stg storage temperature range ?65 150 c (1) stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltage values (except differential voltages and v cc specified for the measurement of i os ) are with respect to the network gnd. (3) differential voltages are at in+ with respect to in?. (4) maximum power dissipation is a function of t j (max), q ja , and t a . the maximum allowable power dissipation at any allowable ambient temperature is p d = (t j (max) ? t a )/ q ja . operating at the absolute maximum t j of 150 c can affect reliability. (5) the package thermal impedance is calculated in accordance with jesd 51-7. typ unit human-body model 2000 v min max unit v cc+ ? v cc? supply voltage 2.7 15 v t j operating virtual junction temperature ?40 85 c 2 submit documentation feedback www.ti.com inC in+ out
2.7-v electrical characteristics tlv7211 , , tlv7211a cmos comparators with rail-to-rail input and push-pull output slcs149b ? august 2006 ? revised january 2007 v cc+ = 2.7 v, v cc? = gnd, v cm = v o = v cc+ /2, and r l > 1 m w (unless otherwise noted) tlv7211a tlv7211 parameter test conditions t j unit min typ max min typ max 25 c 3 5 3 15 v os input offset voltage mv ?40 c to 85 c 8 18 input offset voltage tcv os 25 c 1 1 m v/ c temperature drift input offset voltage 25 c 3.3 3.3 m v/month average drift (1) i b input current 25 c 0.04 0.04 pa i os input offset current 25 c 0.02 0.02 pa common-mode cmrr 0 v cm 2.7 v 25 c 75 75 db rejection ratio power-supply rejection psrr 2.7 v v cc+ 15 v 25 c 80 80 db ratio a v voltage gain 25 c 100 100 db 25 c 2.9 3 2.9 3 cmrr > 55 db ?40 c to 85 c 2.7 2.7 input common-mode cmvr v voltage range 25 c ?0.3 ?0.2 ?0.3 ?0.2 cmrr > 55 db ?40 c to 85 c 0 0 25 c 2.4 2.5 2.4 2.5 high-level output v oh i load = 2.5 ma v voltage ?40 c to 85 c 2.3 2.3 25 c 0.2 0.3 0.2 0.3 low-level output v ol i load = 2.5 ma v voltage ?40 c to 85 c 0.4 0.4 25 c 7 12 7 12 v out = low ?40 c to 85 c 14 14 i cc supply current m a 25 c 5 10 5 10 v out = high-idle ?40 c to 85 c 12 12 (1) input offset voltage average drift is calculated by dividing the accelerated operating life v os drift by the equivalent operational time. this represents worst-case input conditions and includes the first 30 days of drift. 3 submit documentation feedback www.ti.com
5-v electrical characteristics tlv7211 , , tlv7211a cmos comparators with rail-to-rail input and push-pull output slcs149b ? august 2006 ? revised january 2007 v cc+ = 5 v, v cc? = gnd, v cm = v o = v cc+ /2, and r l > 1 m w (unless otherwise noted) tlv7211a tlv7211 parameter test conditions t j unit min typ max min typ max 25 c 3 5 3 15 v os input offset voltage mv ?40 c to 85 c 8 18 input offset voltage tcv os 25 c 1 1 m v/ c temperature drift input offset voltage 25 c 3.3 3.3 m v/month average drift (1) i b input current 25 c 0.04 0.04 pa i os input offset current 25 c 0.02 0.02 pa common-mode cmrr 25 c 75 75 db rejection ratio power-supply rejection psrr 5 v v cc+ 10 v 25 c 80 80 db ratio a v voltage gain 25 c 100 100 db 25 c 5.2 5.3 5.2 5.3 cmrr > 55 db ?40 c to 85 c 5 5 input common-mode cmvr v voltage range 25 c ?0.3 ?0.2 ?0.3 ?0.2 cmrr > 55 db ?40 c to 85 c 0 0 25 c 4.6 4.8 4.6 4.8 high-level output v oh i load = 5 ma v voltage ?40 c to 85 c 4.45 4.45 25 c 0.2 0.4 0.2 0.4 low-level output v ol i load = 5 ma v voltage ?40 c to 85 c 0.55 0.55 25 c 7 14 7 14 v out = low ?40 c to 85 c 18 18 i cc supply current m a 25 c 5 10 5 10 v out = high-idle ?40 c to 85 c 13 13 short-circuit output i oh i source 25 c 30 30 ma current short-circuit output i ol i sink , v o < 12 v (2) 25 c 45 45 ma current (1) input offset voltage average drift is calculated by dividing the accelerated operating life v os drift by the equivalent operational time. this represents worst-case input conditions and includes the first 30 days of drift. (2) do not short circuit the output to v+ if v+ is >12 v. 4 submit documentation feedback www.ti.com
15-v electrical characteristics tlv7211 , , tlv7211a cmos comparators with rail-to-rail input and push-pull output slcs149b ? august 2006 ? revised january 2007 v cc+ = 15 v, v cc? = gnd, v cm = v o = v cc+ /2, and r l > 1 m w (unless otherwise noted) tlv7211a tlv7211 test parameter t j unit conditions min typ max min typ max 25 c 3 5 3 15 v os input offset voltage mv ?40 c to 85 c 8 18 input offset voltage tcv os 25 c 4 4 m v/ c temperature drift input offset voltage average 25 c 4 4 m v/month drift (1) i b input current 25 c 0.04 0.04 pa i os input offset current 25 c 0.02 0.02 pa common-mode rejection cmrr 25 c 82 82 db ratio psrr power-supply rejection ratio 5 v v cc+ 10 v 25 c 80 80 db a v voltage gain 25 c 100 100 db 25 c 15.2 15.3 15.2 15.3 cmrr > 55 db ?40 c to 85 c 15 15 input common-mode voltage cmvr v range 25 c ?0.3 ?0.2 ?0.3 ?0.2 cmrr > 55 db ?40 c to 85 c 0 0 25 c 14.6 14.8 14.6 14.8 v oh high-level output voltage i load = 5 ma v ?40 c to 85 c 14.45 14.45 25 c 0.2 0.4 0.2 0.4 v ol low-level output voltage i load = 5 ma v ?40 c to 85 c 0.55 0.55 25 c 7 14 7 14 v out = low ?40 c to 85 c 18 18 i cc supply current m a 25 c 5 12 5 12 v out = high-idle ?40 c to 85 c 14 14 i oh short-circuit output current i source 25 c 30 30 ma i ol short-circuit output current i sink , v o < 12 v (2) 25 c 45 45 ma (1) input offset voltage average drift is calculated by dividing the accelerated operating life v os drift by the equivalent operational time. this represents worst-case input conditions and includes the first 30 days of drift. (2) do not short circuit the output to v+ if v+ is >12 v. 5 submit documentation feedback www.ti.com
switching characteristics tlv7211 , , tlv7211a cmos comparators with rail-to-rail input and push-pull output slcs149b ? august 2006 ? revised january 2007 t j = 25 c, v cc+ = 5 v, v cc? = gnd, v cm = v o = v cc+ /2, and r l > 1 m w (unless otherwise noted) parameter test conditions typ unit t rise rise time f = 10 khz, c l = 50 pf (1) , overdrive = 10 mv 0.3 m s t fall fall time f = 10 khz, c l = 50 pf (1) , overdrive = 10 mv 0.3 m s 10 mv 10 f = 10 khz, c l = 50 pf (1) 100 mv 4 t phl propagation delay time, high to low (2) m s 10 mv 10 v cc+ = 2.7 v, f = 10 khz, c l = 50 pf (1) 100 mv 4 10 mv 6 f = 10 khz, c l = 50 pf (1) 100 mv 4 t plh propagation delay time, low to high (2) m s 10 mv 7 v cc+ = 2.7 v, f = 10 khz, c l = 50 pf (1) 100 mv 4 (1) c l includes probe and jig capacitance. (2) input step voltage for propagation delay measurement is 2 v. 6 submit documentation feedback www.ti.com
typical characteristics tlv7211 , , tlv7211a cmos comparators with rail-to-rail input and push-pull output slcs149b ? august 2006 ? revised january 2007 supply current supply current vs vs supply voltage supply voltage (sourcing) (sinking) supply current supply current vs vs temperature temperature (sourcing) (sinking) 7 submit documentation feedback www.ti.com 0 2 4 6 8 10 12 14 16 18 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 supply voltage C v supply current C a positive input = 0 v negative input = 0.1 v t a = -40c t a = 25c t a = 85c t a = 125c 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 supply voltage C v supply current C a t a = -40c t a = 25c t a = 85c t a = 125c positive input = 0.1 v negative input = 0 v 0 2 4 6 8 10 12 14 16 18 -40 -25 -10 5 20 35 50 65 80 95 110 125 temperature C c supply current C a positive input = 0 v negative input = 0.1 v 15 v 5 v 2.7 v 0 1 2 3 4 5 6 -40 -25 -10 5 20 35 50 65 80 95 110 125 temperature C c supply current C a positive input = 0.1 v negative input = 0 v v cc = 15 v v cc = 5 v v cc = 2.7 v
tlv7211 , , tlv7211a cmos comparators with rail-to-rail input and push-pull output slcs149b ? august 2006 ? revised january 2007 typical characteristics (continued) output sourcing current output sinking current vs vs supply voltage supply voltage output voltage output voltage vs vs output sourcing current output sinking current 8 submit documentation feedback www.ti.com 0 10 20 30 40 50 60 70 80 0 1 2 3 4 5 6 7 8 9 10 11 12 supply voltage C v source current C ma positive input = 0.1 v negative input = 0 v t a = -40c t a = 25c t a = 85c t a = 125c 0 20 40 60 80 100 120 0 1 2 3 4 5 6 7 8 9 10 11 12 supply voltage C v sinking current C ma positive input = 0.1 v negative input = 0 v t a = -40c t a = 25c t a = 85c t a = 125c 0 100 200 300 400 500 600 700 800 900 0 1 2 3 4 5 6 7 8 9 10 output sinking current C ma output voltage to gnd C mv v cc = 5 v t a = -40c t a = 25c t a = 85c t a = 125c 0 200 400 600 800 1000 1200 0 1 2 3 4 5 6 7 8 9 10 output sourcing current C ma output voltage to v cc C mv v cc = 5 v t a = -40c t a = 25c t a = 125c t a = 85c output v oltage to v C mv cc
tlv7211 , , tlv7211a cmos comparators with rail-to-rail input and push-pull output slcs149b ? august 2006 ? revised january 2007 typical characteristics (continued) output voltage output voltage vs vs output sourcing current output sinking current response time (t plh ) for various input overdrives response time (t phl ) for various input overdrives (v cc = 2.7 v) (v cc = 2.7 v) 9 submit documentation feedback www.ti.com 0 200 400 600 800 1000 1200 1400 1600 0 1 2 3 4 5 6 7 8 9 10 output sourcing current C ma output voltage to v cc C mv v cc = 15 v t a = -40c t a = 25c t a = 85c t a = 125c output voltage to v C mv cc 2 s per division 1 v per division 20 mv 100 mv 5 mv 10 mv 2 s per division 1 v per division 100 mv 20 mv 10 mv 5 mv input 0 100 200 300 400 500 600 700 800 900 0 1 2 3 4 5 6 7 8 9 10 output sinking current C ma output voltage to gnd C mv v cc = 15 v t a = -40c t a = 25c t a = 85c t a = 125c
tlv7211 , , tlv7211a cmos comparators with rail-to-rail input and push-pull output slcs149b ? august 2006 ? revised january 2007 typical characteristics (continued) response time (t plh ) for various input overdrives response time (t phl ) for various input overdrives (v cc = 5 v) (v cc = 5 v) response time (t plh ) for various input overdrives response time (t phl ) for various input overdrives (v cc = 15 v) (v cc = 15 v) 10 submit documentation feedback www.ti.com 2 s per division 3 v per division 100 mv 20 mv 10 mv 5 mv input 2 s per division 3 v per division 100 mv 20 mv 10 mv 5 mv input 2 s per division 1 v per division 100 mv 20 mv 10 mv 5 mv input 2 s per division 1 v per division 100 mv 20 mv 10 mv 5 mv input
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) TLV7211AID active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim TLV7211AIDbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim TLV7211AIDbvrg4 active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim TLV7211AIDckr active sc70 dck 6 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim TLV7211AIDckrg4 active sc70 dck 6 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim TLV7211AIDckt active sc70 dck 6 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim TLV7211AIDcktg4 active sc70 dck 6 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim TLV7211AIDg4 active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim TLV7211AIDr active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim TLV7211AIDrg4 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tlv7211id active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tlv7211idbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tlv7211idbvrg4 active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tlv7211idckr active sc70 dck 6 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tlv7211idckrg4 active sc70 dck 6 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tlv7211idckt active sc70 dck 6 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tlv7211idcktg4 active sc70 dck 6 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tlv7211idg4 active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tlv7211idr active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tlv7211idrg4 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. package option addendum www.ti.com 25-jan-2007 addendum-page 1
tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 25-jan-2007 addendum-page 2
tape and reel information package materials information www.ti.com 19-may-2007 pack materials-page 1
device package pins site reel diameter (mm) reel width (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant TLV7211AIDbvr dbv 5 nfme 0 0 3.23 3.17 1.37 4 8 q3 TLV7211AIDckr dck 6 hnt 180 9 2.24 2.34 1.22 4 8 q3 TLV7211AIDckt dck 6 hnt 180 9 2.24 2.34 1.22 4 8 q3 TLV7211AIDr d 8 fmx 330 12 6.4 5.2 2.1 8 12 q1 tlv7211idbvr dbv 5 nfme 0 0 3.23 3.17 1.37 4 8 q3 tlv7211idckr dck 6 hnt 180 9 2.24 2.34 1.22 4 8 q3 tlv7211idckt dck 6 hnt 180 9 2.24 2.34 1.22 4 8 q3 tlv7211idr d 8 fmx 330 12 6.4 5.2 2.1 8 12 q1 tape and reel box information device package pins site length (mm) width (mm) height (mm) TLV7211AIDbvr dbv 5 nfme 185.0 185.0 220.0 TLV7211AIDckr dck 6 hnt 202.0 201.0 28.0 TLV7211AIDckt dck 6 hnt 202.0 201.0 28.0 TLV7211AIDr d 8 fmx 338.1 340.5 20.64 tlv7211idbvr dbv 5 nfme 185.0 185.0 220.0 tlv7211idckr dck 6 hnt 202.0 201.0 28.0 tlv7211idckt dck 6 hnt 202.0 201.0 28.0 tlv7211idr d 8 fmx 338.1 340.5 20.64 package materials information www.ti.com 19-may-2007 pack materials-page 2
package materials information www.ti.com 19-may-2007 pack materials-page 3



important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers 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are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security rfid www.ti-rfid.com telephony www.ti.com/telephony low power www.ti.com/lpw video & imaging www.ti.com/video wireless wireless www.ti.com/wireless mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2007, texas instruments incorporated


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